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Electronic Packaging Adhesives Market Size, Share and Forecast 2026-2036

The global electronic packaging adhesives market is worth USD 3.1 bn in 2026 and is forecast to reach USD 6.4 bn by 2036, growing at a 7.5% CAGR. China is the largest country market and Die attach adhesives and films is the largest by product segment.

USD 3.1 bnMarket size 2026
USD 6.4 bnForecast 2036
7.5%CAGR 2026-2036
ChinaLargest country

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5 segmentation views25 countries2026 to 2036 yearly forecast

Market overview

The global electronic packaging adhesives market is worth USD 3.1 bn in 2026 and is forecast to reach USD 6.4 bn by 2036, growing at a 7.5% CAGR. China is the largest country market and Die attach adhesives and films is the largest by product segment.

ScopeAdhesives, underfills, encapsulants, conductive pastes and thermal interface adhesives used to attach, bond and protect semiconductor chips and electronic modules in packages.
IndustryChemicals and Materials
Value 2025USD 2.9 bn
Value 2026USD 3.1 bn
Value 2036USD 6.4 bn
CAGR 2026-20367.5%
Volume 2026121,832 tonnes
Volume 2036227,317 tonnes
Average price 2026USD 25,470 per tonne
Report priceStarts from USD 1,999
PublishedNovember 2026

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Electronic Packaging Adhesives market size and forecast, 2026-2036

Exhibit 1The global electronic packaging adhesives market is forecast to grow from USD 3.1 bn in 2026 to USD 6.4 bn by 2036, more than doublingGlobal market value in USD: 2025 base year, 2026 estimate and forecast to 2036. CAGR 2026 to 2036: 7.5%
Electronic Packaging Adhesives market value, 2025 to 2036Market value by year. 2025: USD 2.9 bn; 2026: USD 3.1 bn; 2027: USD 3.3 bn; 2028: USD 3.6 bn; 2029: USD 3.9 bn; 2030: USD 4.1 bn; 2031: USD 4.5 bn; 2032: USD 4.8 bn; 2033: USD 5.1 bn; 2034: USD 5.5 bn; 2035: USD 5.9 bn; 2036: USD 6.4 bn. Compound annual growth rate 2026 to 2036: 7.5%.20253.1 bn20264.5 bn20316.4 bn20367.5% CAGR

Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.

YearMarket value
2026USD 3.1 bn
2027USD 3.3 bn
2028USD 3.6 bn
2029USD 3.9 bn
2030USD 4.1 bn
2031USD 4.5 bn
2032USD 4.8 bn
2033USD 5.1 bn
2034USD 5.5 bn
2035USD 5.9 bn
2036USD 6.4 bn

Electronic Packaging Adhesives market segmentation

By product

Exhibit 2Die attach adhesives and films is the largest segment by product, with 24.0% of 2026 revenueEstimated share of 2026 global revenue, by product
Electronic Packaging Adhesives market share by product, 2026Share of 2026 revenue by product. Die attach adhesives and films: 24.0%; Underfill: 22.0%; Encapsulants, glob-top and potting: 20.0%; Conductive adhesives: 18.0%; Thermal interface adhesives: 10.0%; Other: 6.0%.Die attach adhesives and films24.0%Underfill22.0%Encapsulants, glob-top and potting20.0%Conductive adhesives18.0%Thermal interface adhesives10.0%Other6.0%

Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.

SegmentShare 2026Share 2036Value 2026CAGR 2026-36
Die attach adhesives and films24.0%22.7%USD 745 mn6.9%
Underfill22.0%23.9%USD 683 mn8.4%
Encapsulants, glob-top and potting20.0%19.8%USD 621 mn7.4%
Conductive adhesives18.0%17.0%USD 559 mn6.9%
Thermal interface adhesives10.0%11.9%USD 310 mn9.4%
Other6.0%4.7%USD 186 mn4.9%

By chemistry

Exhibit 3Epoxy adds the most revenue by chemistry, growing from USD 1.8 bn in 2026 to USD 3.6 bn by 2036Estimated revenue in USD by chemistry, 2026 and 2036 forecast
Electronic Packaging Adhesives market by chemistry, 2026 and 2036Revenue by chemistry in 2026 and 2036. Epoxy: USD 1.8 bn in 2026, USD 3.6 bn in 2036, change +100%; Silicone: USD 621 mn in 2026, USD 1.3 bn in 2036, change +109%; Polyimide and other: USD 372 mn in 2026, USD 855 mn in 2036, change +129%; Acrylic and UV-cure: USD 310 mn in 2026, USD 649 mn in 2036, change +109%.20262036 forecastChangeEpoxy+100%1.8 bn3.6 bnSilicone+109%621 mn1.3 bnPolyimide and other+129%372 mn855 mnAcrylic and UV-cure+109%310 mn649 mn

Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.

SegmentShare 2026Share 2036Value 2026CAGR 2026-36
Epoxy58.0%56.2%USD 1.8 bn7.2%
Silicone20.0%20.3%USD 621 mn7.7%
Acrylic and UV-cure10.0%10.1%USD 310 mn7.7%
Polyimide and other12.0%13.4%USD 372 mn8.7%

By application

SegmentShare 2026Share 2036Value 2026CAGR 2026-36
Advanced packaging36.0%43.9%USD 1.1 bn9.7%
Automotive electronics20.0%20.3%USD 621 mn7.7%
Consumer electronics22.0%16.8%USD 683 mn4.7%
Industrial and power12.0%10.6%USD 372 mn6.2%
Medical and aerospace10.0%8.4%USD 310 mn5.7%

By cure method

SegmentShare 2026Share 2036Value 2026CAGR 2026-36
Thermal cure46.0%42.0%USD 1.4 bn6.5%
UV cure22.0%24.0%USD 683 mn8.4%
Moisture and room temperature16.0%16.0%USD 496 mn7.5%
Dual cure16.0%18.0%USD 496 mn8.8%

By form

SegmentShare 2026Share 2036Value 2026CAGR 2026-36
Paste38.0%36.0%USD 1.2 bn6.9%
Film22.0%26.0%USD 683 mn9.3%
Liquid28.0%26.0%USD 869 mn6.7%
Tape12.0%12.0%USD 372 mn7.5%

Top 25 countries for electronic packaging adhesives by revenue

Countries are ranked by revenue earned from sales in the country, not by where the product is made. The ten largest hold 90.5% of 2026 revenue and the 25 countries below together hold 97.3%.

Exhibit 4China is the largest country market at USD 807 mn in 2026, and the three largest countries hold 54.0% of global revenueEstimated 2026 revenue in USD and share of the global market, ten largest countries
Electronic Packaging Adhesives market, ten largest countries in 2026Ten largest countries by 2026 revenue. China: USD 807 mn, 26.0%; Taiwan: USD 465 mn, 15.0%; South Korea: USD 403 mn, 13.0%; Japan: USD 310 mn, 10.0%; United States: USD 279 mn, 9.0%; Malaysia: USD 155 mn, 5.0%; Singapore: USD 124 mn, 4.0%; Germany: USD 93 mn, 3.0%; Vietnam: USD 93 mn, 3.0%; Philippines: USD 78 mn, 2.5%.China807 mn 26.0%Taiwan465 mn 15.0%South Korea403 mn 13.0%Japan310 mn 10.0%United States279 mn 9.0%Malaysia155 mn 5.0%Singapore124 mn 4.0%Germany93 mn 3.0%Vietnam93 mn 3.0%Philippines78 mn 2.5%

Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.

#CountryValue 2026Share 2026Value 2036CAGR 2026-36
1ChinaUSD 807 mn26.0%USD 1.7 bn8.0%
2TaiwanUSD 465 mn15.0%USD 959 mn7.5%
3South KoreaUSD 403 mn13.0%USD 793 mn7.0%
4JapanUSD 310 mn10.0%USD 531 mn5.5%
5United StatesUSD 279 mn9.0%USD 601 mn8.0%
6MalaysiaUSD 155 mn5.0%USD 352 mn8.5%
7SingaporeUSD 124 mn4.0%USD 243 mn7.0%
8GermanyUSD 93 mn3.0%USD 166 mn6.0%
9VietnamUSD 93 mn3.0%USD 262 mn10.9%
10PhilippinesUSD 78 mn2.5%USD 153 mn7.1%
11ThailandUSD 38 mn1.2%USD 82 mn7.8%
12IsraelUSD 25 mn0.8%USD 52 mn7.4%
13IrelandUSD 20 mn0.6%USD 40 mn7.3%
14NetherlandsUSD 17 mn0.5%USD 32 mn6.7%
15MexicoUSD 15 mn0.5%USD 33 mn8.4%
16Hong KongUSD 13 mn0.4%USD 23 mn5.9%
17Czech RepublicUSD 12 mn0.4%USD 24 mn6.9%
18HungaryUSD 11 mn0.4%USD 22 mn6.9%
19PolandUSD 10 mn0.3%USD 22 mn7.8%
20CanadaUSD 9.6 mn0.3%USD 19 mn6.8%
21SwitzerlandUSD 9.0 mn0.3%USD 17 mn6.7%
22AustriaUSD 8.7 mn0.3%USD 16 mn6.3%
23AustraliaUSD 8.4 mn0.3%USD 17 mn7.1%
24IndonesiaUSD 7.8 mn0.2%USD 19 mn9.1%
25IndiaUSD 7.5 mn0.2%USD 18 mn9.2%
Rest of worldUSD 82 mn2.6%USD 161 mn7.0%
Exhibit 5China and Taiwan account for 43% of the USD 3.3 bn the market is forecast to add by 2036Forecast revenue added between 2026 and 2036 by country, in USD
Electronic Packaging Adhesives market, where the growth to 2036 comes fromRevenue added between 2026 and 2036. Market value 2026: USD 3.1 bn. China: +USD 933 mn; Taiwan: +USD 494 mn; South Korea: +USD 390 mn; United States: +USD 322 mn; Japan: +USD 221 mn; 20 other countries: +USD 855 mn; Rest of world: +USD 79 mn. Market value 2036: USD 6.4 bn.Market value 20263.1 bnChina+933 mnTaiwan+494 mnSouth Korea+390 mnUnited States+322 mnJapan+221 mn20 other countries+855 mnRest of world+79 mnMarket value 20366.4 bn

Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.

Competitive landscape

Group 1: Global leaders

  • Henkel
  • Namics
  • Resonac
  • Sumitomo Bakelite
  • 3M
  • DuPont
  • Nitto Denko
  • Heraeus

Group 2: Regional and specialist players

  • Dow
  • Shin-Etsu Chemical
  • Panasonic Industry
  • H.B. Fuller
  • Indium Corporation
  • Alpha Assembly Solutions
  • Delo
  • Dymax
  • Kyocera
  • Nagase ChemteX

Group 3: Emerging and niche players

  • Epoxy Technology
  • Master Bond
  • AI Technology
  • Creative Materials
  • Panacol
  • MG Chemicals
  • Darbond Technology

Research methodology

Every figure on this page comes from the research framework that we apply to all of the markets we cover. The 2025 base for the electronic packaging adhesives market is built from the volume sold and the price that buyers pay, and is cross-checked against the size of the wider industry the market belongs to. Where a market can be sized in more than one way, the routes are compared before a figure is set.

The forecast runs year by year from the 2025 base to 2036. Growth in each year reflects demand from the industries that buy the product, adoption of new technology, pricing, regulation and replacement cycles. Volume and price are modelled together, so revenue in each year equals volume multiplied by average price. The 2026 to 2036 compound annual growth rate of 7.5% is calculated from the resulting values.

The market is divided by product, by chemistry, by application, by cure method, by form. The 25 largest countries are ranked by revenue earned from sales to buyers in each country, not by where the product is made. Segment values and country values add up to the market total in every year, and every report is checked for consistency before it is published.

Companies are placed in three groups: global leaders, regional and specialist players, and emerging and niche players. The groups describe how companies compete in the market. They are not a ranking and they are not market shares.

Our analysts also carry out primary research. Customized reports add interviews with key opinion leaders, such as senior executives, technical specialists and buyers, to test the assumptions behind the numbers for the question being asked.

Read the full research methodology

Frequently asked questions

How big is the electronic packaging adhesives market?

The global electronic packaging adhesives market is estimated at USD 2.9 bn in 2025 and USD 3.1 bn in 2026.

How fast will the electronic packaging adhesives market grow?

It is forecast to reach USD 6.4 bn by 2036, a compound annual growth rate of 7.5% from 2026, an increase of USD 3.3 bn.

Which country is the largest market for electronic packaging adhesives?

China is the largest market by revenue at USD 807 mn in 2026, 26.0% of the global total. The three largest countries together hold 54.0%.

Which country is growing fastest?

Among the ten largest markets, Vietnam is growing fastest at 10.9% a year from 2026 to 2036.

Which electronic packaging adhesives segment is largest?

In the by product split, Die attach adhesives and films is the largest segment with 24.0% of 2026 revenue.

Who are the leading electronic packaging adhesives companies?

Global leaders include Henkel, Namics, Resonac, Sumitomo Bakelite.

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