Market overview
The global electronic board level underfill material market is worth USD 458 mn in 2026 and is forecast to reach USD 884 mn by 2036, growing at a 6.8% CAGR. China is the largest country market and Capillary underfill is the largest by type segment.
| Scope | Capillary and no-flow epoxy underfill materials dispensed under chips, BGAs and CSPs on circuit boards to improve drop and thermal-cycle reliability in phones, vehicles and computers. |
|---|---|
| Industry | Chemicals and Materials |
| Value 2025 | USD 430 mn |
| Value 2026 | USD 458 mn |
| Value 2036 | USD 884 mn |
| CAGR 2026-2036 | 6.8% |
| Volume 2026 | 3,073 tonnes |
| Volume 2036 | 5,645 tonnes |
| Average price 2026 | USD 149,000 per tonne |
| Report price | Starts from USD 1,999 |
| Published | November 2026 |
Request a free sample of this report
Electronic Board Level Underfill Material market size and forecast, 2026-2036
Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.
| Year | Market value |
|---|---|
| 2026 | USD 458 mn |
| 2027 | USD 489 mn |
| 2028 | USD 522 mn |
| 2029 | USD 558 mn |
| 2030 | USD 596 mn |
| 2031 | USD 636 mn |
| 2032 | USD 680 mn |
| 2033 | USD 726 mn |
| 2034 | USD 775 mn |
| 2035 | USD 828 mn |
| 2036 | USD 884 mn |
Electronic Board Level Underfill Material market segmentation
By type
Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.
| Segment | Share 2026 | Share 2036 | Value 2026 | CAGR 2026-36 |
|---|---|---|---|---|
| Capillary underfill | 60.0% | 56.4% | USD 275 mn | 6.2% |
| Corner and edge bond | 22.0% | 25.0% | USD 101 mn | 8.2% |
| No-flow and pre-applied | 18.0% | 18.6% | USD 82 mn | 7.2% |
By end use
Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.
| Segment | Share 2026 | Share 2036 | Value 2026 | CAGR 2026-36 |
|---|---|---|---|---|
| Smartphones and tablets | 34.0% | 31.1% | USD 156 mn | 5.8% |
| Automotive electronics | 24.0% | 30.3% | USD 110 mn | 9.3% |
| Computing and servers | 20.0% | 19.2% | USD 92 mn | 6.3% |
| Industrial and telecom | 14.0% | 12.8% | USD 64 mn | 5.8% |
| Other electronics | 8.0% | 6.6% | USD 37 mn | 4.8% |
By application method
| Segment | Share 2026 | Share 2036 | Value 2026 | CAGR 2026-36 |
|---|---|---|---|---|
| Capillary underfill | 48.0% | 40.0% | USD 220 mn | 4.9% |
| No-flow underfill | 12.0% | 12.0% | USD 55 mn | 6.8% |
| Molded underfill | 26.0% | 32.0% | USD 119 mn | 9.0% |
| Edge bond and corner fill | 14.0% | 16.0% | USD 64 mn | 8.2% |
By package type
| Segment | Share 2026 | Share 2036 | Value 2026 | CAGR 2026-36 |
|---|---|---|---|---|
| Flip chip BGA | 36.0% | 32.0% | USD 165 mn | 5.5% |
| CSP and BGA | 28.0% | 26.0% | USD 128 mn | 6.0% |
| Wafer-level and fan-out | 22.0% | 28.0% | USD 101 mn | 9.4% |
| QFN and other packages | 14.0% | 14.0% | USD 64 mn | 6.8% |
By cure method
| Segment | Share 2026 | Share 2036 | Value 2026 | CAGR 2026-36 |
|---|---|---|---|---|
| Thermal cure | 62.0% | 56.0% | USD 284 mn | 5.7% |
| UV and dual cure | 20.0% | 24.0% | USD 92 mn | 8.8% |
| Room temperature cure | 18.0% | 20.0% | USD 82 mn | 7.9% |
Top 25 countries for electronic board level underfill material by revenue
Countries are ranked by revenue earned from sales in the country, not by where the product is made. The ten largest hold 93.5% of 2026 revenue and the 25 countries below together hold 98.0%.
Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.
| # | Country | Value 2026 | Share 2026 | Value 2036 | CAGR 2026-36 |
|---|---|---|---|---|---|
| 1 | China | USD 156 mn | 34.0% | USD 309 mn | 7.1% |
| 2 | Taiwan | USD 55 mn | 12.0% | USD 95 mn | 5.6% |
| 3 | South Korea | USD 46 mn | 10.0% | USD 80 mn | 5.7% |
| 4 | United States | USD 41 mn | 9.0% | USD 68 mn | 5.2% |
| 5 | Japan | USD 37 mn | 8.0% | USD 55 mn | 4.1% |
| 6 | Vietnam | USD 27 mn | 6.0% | USD 75 mn | 10.6% |
| 7 | India | USD 23 mn | 5.0% | USD 69 mn | 11.7% |
| 8 | Germany | USD 18 mn | 4.0% | USD 29 mn | 4.8% |
| 9 | Malaysia | USD 14 mn | 3.0% | USD 27 mn | 6.8% |
| 10 | Thailand | USD 11 mn | 2.5% | USD 23 mn | 7.2% |
| 11 | Philippines | USD 3.9 mn | 0.8% | USD 8.3 mn | 8.0% |
| 12 | Israel | USD 2.5 mn | 0.5% | USD 4.8 mn | 6.8% |
| 13 | Netherlands | USD 1.9 mn | 0.4% | USD 3.5 mn | 6.0% |
| 14 | Mexico | USD 1.6 mn | 0.3% | USD 3.4 mn | 7.7% |
| 15 | Hungary | USD 1.4 mn | 0.3% | USD 2.6 mn | 6.1% |
| 16 | Czech Republic | USD 1.2 mn | 0.3% | USD 2.3 mn | 6.4% |
| 17 | Ireland | USD 1.1 mn | 0.2% | USD 2.1 mn | 6.4% |
| 18 | Hong Kong | USD 1.1 mn | 0.2% | USD 1.7 mn | 4.8% |
| 19 | Poland | USD 0.96 mn | 0.2% | USD 1.9 mn | 7.3% |
| 20 | Canada | USD 0.92 mn | 0.2% | USD 1.6 mn | 5.7% |
| 21 | Singapore | USD 0.87 mn | 0.2% | USD 1.7 mn | 6.8% |
| 22 | Switzerland | USD 0.82 mn | 0.2% | USD 1.4 mn | 5.5% |
| 23 | Austria | USD 0.78 mn | 0.2% | USD 1.3 mn | 5.5% |
| 24 | Australia | USD 0.73 mn | 0.2% | USD 1.4 mn | 6.8% |
| 25 | Spain | USD 0.69 mn | 0.1% | USD 1.2 mn | 6.1% |
| Rest of world | USD 9.3 mn | 2.0% | USD 16 mn | 5.3% |
Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.
Competitive landscape
Group 1: Global leaders
- Henkel
- Namics
- Shin-Etsu Chemical
- Panasonic
- Nagase ChemteX
- Dow
Group 2: Regional and specialist players
- MacDermid Alpha
- Resonac
- Sumitomo Bakelite
- Delo
- Kyocera
- Won Chemical
Group 3: Emerging and niche players
- Zymet
- Master Bond
- Epoxy Technology
- AI Technology
- Darbond Technology
Research methodology
Every figure on this page comes from the research framework that we apply to all of the markets we cover. The 2025 base for the electronic board level underfill material market is built from the volume sold and the price that buyers pay, and is cross-checked against the size of the wider industry the market belongs to. Where a market can be sized in more than one way, the routes are compared before a figure is set.
The forecast runs year by year from the 2025 base to 2036. Growth in each year reflects demand from the industries that buy the product, adoption of new technology, pricing, regulation and replacement cycles. Volume and price are modelled together, so revenue in each year equals volume multiplied by average price. The 2026 to 2036 compound annual growth rate of 6.8% is calculated from the resulting values.
The market is divided by type, by end use, by application method, by package type, by cure method. The 25 largest countries are ranked by revenue earned from sales to buyers in each country, not by where the product is made. Segment values and country values add up to the market total in every year, and every report is checked for consistency before it is published.
Companies are placed in three groups: global leaders, regional and specialist players, and emerging and niche players. The groups describe how companies compete in the market. They are not a ranking and they are not market shares.
Our analysts also carry out primary research. Customized reports add interviews with key opinion leaders, such as senior executives, technical specialists and buyers, to test the assumptions behind the numbers for the question being asked.
Frequently asked questions
How big is the electronic board level underfill material market?
The global electronic board level underfill material market is estimated at USD 430 mn in 2025 and USD 458 mn in 2026.
How fast will the electronic board level underfill material market grow?
It is forecast to reach USD 884 mn by 2036, a compound annual growth rate of 6.8% from 2026, an increase of USD 426 mn.
Which country is the largest market for electronic board level underfill material?
China is the largest market by revenue at USD 156 mn in 2026, 34.0% of the global total. The three largest countries together hold 56.0%.
Which country is growing fastest?
Among the ten largest markets, India is growing fastest at 11.7% a year from 2026 to 2036.
Which electronic board level underfill material segment is largest?
In the by type split, Capillary underfill is the largest segment with 60.0% of 2026 revenue.
Who are the leading electronic board level underfill material companies?
Global leaders include Henkel, Namics, Shin-Etsu Chemical, Panasonic.
Need the full report?
Request a sample to see the structure, tables and country detail.
Request a free sampleRelated markets in Chemicals and Materials
- GrapheneUSD 456 mn · 21.0% CAGR
- IndiumUSD 462 mn · 5.0% CAGR
- Biodegradable Chelating Water Treatment AgentsUSD 462 mn · 7.8% CAGR
- Gas-Phase Activated Carbon ImpregnationsUSD 454 mn · 5.8% CAGR
- Asia Pacific Flexible GlassUSD 470 mn · 11.0% CAGR
- Extra Low Interstitial TitaniumUSD 445 mn · 6.2% CAGR
- Low-Impact Textile Dye Fixing AgentsUSD 441 mn · 5.0% CAGR
- BismuthUSD 477 mn · 5.2% CAGR
← Electromagnetic Shielding Polymers EV Components Electronic Packaging Adhesives →