Market overview
The global chiplet underfills market is worth USD 242 mn in 2026 and is forecast to reach USD 657 mn by 2036, growing at a 10.5% CAGR. Taiwan is the largest country market and Capillary underfill is the largest by type segment.
| Scope | Epoxy resins dispensed under flip-chip and chiplet dies to protect solder bumps and improve reliability in advanced semiconductor packages, including capillary and no-flow underfills. |
|---|---|
| Industry | Technology |
| Value 2025 | USD 220 mn |
| Value 2026 | USD 242 mn |
| Value 2036 | USD 657 mn |
| CAGR 2026-2036 | 10.5% |
| Volume 2026 | 660 tonnes |
| Volume 2036 | 1,791 tonnes |
| Average price 2026 | USD 366,700 per tonne |
| Report price | Starts from USD 1,999 |
| Published | November 2026 |
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Chiplet Underfills market size and forecast, 2026-2036
Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.
| Year | Market value |
|---|---|
| 2026 | USD 242 mn |
| 2027 | USD 267 mn |
| 2028 | USD 295 mn |
| 2029 | USD 327 mn |
| 2030 | USD 361 mn |
| 2031 | USD 399 mn |
| 2032 | USD 441 mn |
| 2033 | USD 487 mn |
| 2034 | USD 538 mn |
| 2035 | USD 594 mn |
| 2036 | USD 657 mn |
Chiplet Underfills market segmentation
By type
Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.
| Segment | Share 2026 | Share 2036 | Value 2026 | CAGR 2026-36 |
|---|---|---|---|---|
| Capillary underfill | 62.0% | 56.6% | USD 150 mn | 9.5% |
| Molded underfill | 22.0% | 25.2% | USD 53 mn | 12.0% |
| Non-conductive paste and film | 16.0% | 18.3% | USD 39 mn | 12.0% |
By end use
Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.
| Segment | Share 2026 | Share 2036 | Value 2026 | CAGR 2026-36 |
|---|---|---|---|---|
| High-performance computing and AI | 36.0% | 48.3% | USD 87 mn | 13.8% |
| Smartphones and consumer devices | 34.0% | 25.4% | USD 82 mn | 7.3% |
| Automotive | 18.0% | 16.9% | USD 44 mn | 9.8% |
| Other | 12.0% | 9.4% | USD 29 mn | 7.8% |
By filler
| Segment | Share 2026 | Share 2036 | Value 2026 | CAGR 2026-36 |
|---|---|---|---|---|
| Silica-filled epoxy | 62.0% | 58.0% | USD 150 mn | 9.8% |
| Thermally conductive (alumina, boron nitride) | 24.0% | 28.0% | USD 58 mn | 12.2% |
| Low-stress and unfilled | 14.0% | 14.0% | USD 34 mn | 10.5% |
By package type
| Segment | Share 2026 | Share 2036 | Value 2026 | CAGR 2026-36 |
|---|---|---|---|---|
| 2.5D interposer | 34.0% | 36.0% | USD 82 mn | 11.1% |
| 3D stacked | 14.0% | 22.0% | USD 34 mn | 15.6% |
| Fan-out | 20.0% | 20.0% | USD 48 mn | 10.5% |
| Flip-chip BGA | 32.0% | 22.0% | USD 77 mn | 6.4% |
By cure method
| Segment | Share 2026 | Share 2036 | Value 2026 | CAGR 2026-36 |
|---|---|---|---|---|
| Thermal cure | 66.0% | 58.0% | USD 160 mn | 9.1% |
| Snap-cure | 24.0% | 28.0% | USD 58 mn | 12.2% |
| UV-assisted | 10.0% | 14.0% | USD 24 mn | 14.3% |
Top 25 countries for chiplet underfills by revenue
Countries are ranked by revenue earned from sales in the country, not by where the product is made. The ten largest hold 99.0% of 2026 revenue and the 25 countries below together hold 99.7%.
Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.
| # | Country | Value 2026 | Share 2026 | Value 2036 | CAGR 2026-36 |
|---|---|---|---|---|---|
| 1 | Taiwan | USD 63 mn | 26.0% | USD 177 mn | 10.9% |
| 2 | China | USD 48 mn | 20.0% | USD 143 mn | 11.4% |
| 3 | South Korea | USD 34 mn | 14.0% | USD 87 mn | 9.8% |
| 4 | United States | USD 29 mn | 12.0% | USD 81 mn | 10.9% |
| 5 | Japan | USD 22 mn | 9.0% | USD 47 mn | 7.9% |
| 6 | Malaysia | USD 15 mn | 6.0% | USD 41 mn | 10.9% |
| 7 | Singapore | USD 12 mn | 5.0% | USD 31 mn | 9.8% |
| 8 | Philippines | USD 8.5 mn | 3.5% | USD 20 mn | 8.8% |
| 9 | Vietnam | USD 4.8 mn | 2.0% | USD 16 mn | 13.0% |
| 10 | Germany | USD 3.6 mn | 1.5% | USD 7.9 mn | 8.1% |
| 11 | Ireland | USD 0.38 mn | 0.2% | USD 0.99 mn | 10.0% |
| 12 | Israel | USD 0.30 mn | 0.1% | USD 0.78 mn | 10.0% |
| 13 | Thailand | USD 0.23 mn | 0.1% | USD 0.76 mn | 12.5% |
| 14 | India | USD 0.18 mn | 0.07% | USD 0.58 mn | 12.4% |
| 15 | Netherlands | USD 0.14 mn | 0.06% | USD 0.37 mn | 10.1% |
| 16 | France | USD 0.11 mn | 0.05% | USD 0.29 mn | 10.0% |
| 17 | Hungary | USD 87 thousand | 0.04% | USD 0.22 mn | 9.9% |
| 18 | Czech Republic | USD 68 thousand | 0.03% | USD 0.17 mn | 9.7% |
| 19 | Canada | USD 53 thousand | 0.02% | USD 0.14 mn | 10.0% |
| 20 | Austria | USD 41 thousand | 0.02% | USD 0.11 mn | 9.8% |
| 21 | Mexico | USD 31 thousand | 0.01% | USD 85 thousand | 10.5% |
| 22 | Italy | USD 24 thousand | 0.01% | USD 66 thousand | 10.5% |
| 23 | Spain | USD 19 thousand | 0.008% | USD 53 thousand | 10.5% |
| 24 | Poland | USD 15 thousand | 0.006% | USD 39 thousand | 10.5% |
| 25 | Indonesia | USD 12 thousand | 0.005% | USD 33 thousand | 10.5% |
| Rest of world | USD 0.72 mn | 0.3% | USD 2.5 mn | 13.4% |
Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.
Competitive landscape
Group 1: Global leaders
- Henkel
- Namics
- Resonac
- Sumitomo Bakelite
- Nagase ChemteX
- Dow
- LORD
Group 2: Regional and specialist players
- Shin-Etsu Chemical
- Panasonic Industry
- Zymet
- Master Bond
- DELO
- Kyocera Chemical
- ThreeBond
Group 3: Emerging and niche players
- Epoxy Technology
- Darbond Technology
- Panacol
Research methodology
Every figure on this page comes from the research framework that we apply to all of the markets we cover. The 2025 base for the chiplet underfills market is built from the volume sold and the price that buyers pay, and is cross-checked against the size of the wider industry the market belongs to. Where a market can be sized in more than one way, the routes are compared before a figure is set.
The forecast runs year by year from the 2025 base to 2036. Growth in each year reflects demand from the industries that buy the product, adoption of new technology, pricing, regulation and replacement cycles. Volume and price are modelled together, so revenue in each year equals volume multiplied by average price. The 2026 to 2036 compound annual growth rate of 10.5% is calculated from the resulting values.
The market is divided by type, by end use, by filler, by package type, by cure method. The 25 largest countries are ranked by revenue earned from sales to buyers in each country, not by where the product is made. Segment values and country values add up to the market total in every year, and every report is checked for consistency before it is published.
Companies are placed in three groups: global leaders, regional and specialist players, and emerging and niche players. The groups describe how companies compete in the market. They are not a ranking and they are not market shares.
Our analysts also carry out primary research. Customized reports add interviews with key opinion leaders, such as senior executives, technical specialists and buyers, to test the assumptions behind the numbers for the question being asked.
Frequently asked questions
How big is the chiplet underfills market?
The global chiplet underfills market is estimated at USD 220 mn in 2025 and USD 242 mn in 2026.
How fast will the chiplet underfills market grow?
It is forecast to reach USD 657 mn by 2036, a compound annual growth rate of 10.5% from 2026, an increase of USD 415 mn.
Which country is the largest market for chiplet underfills?
Taiwan is the largest market by revenue at USD 63 mn in 2026, 26.0% of the global total. The three largest countries together hold 60.0%.
Which country is growing fastest?
Among the ten largest markets, Vietnam is growing fastest at 13.0% a year from 2026 to 2036.
Which chiplet underfills segment is largest?
In the by type split, Capillary underfill is the largest segment with 62.0% of 2026 revenue.
Who are the leading chiplet underfills companies?
Global leaders include Henkel, Namics, Resonac, Sumitomo Bakelite.
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