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Chiplet Underfills Market Size, Share and Forecast 2026-2036

The global chiplet underfills market is worth USD 242 mn in 2026 and is forecast to reach USD 657 mn by 2036, growing at a 10.5% CAGR. Taiwan is the largest country market and Capillary underfill is the largest by type segment.

USD 242 mnMarket size 2026
USD 657 mnForecast 2036
10.5%CAGR 2026-2036
TaiwanLargest country

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5 segmentation views25 countries2026 to 2036 yearly forecast

Market overview

The global chiplet underfills market is worth USD 242 mn in 2026 and is forecast to reach USD 657 mn by 2036, growing at a 10.5% CAGR. Taiwan is the largest country market and Capillary underfill is the largest by type segment.

ScopeEpoxy resins dispensed under flip-chip and chiplet dies to protect solder bumps and improve reliability in advanced semiconductor packages, including capillary and no-flow underfills.
IndustryTechnology
Value 2025USD 220 mn
Value 2026USD 242 mn
Value 2036USD 657 mn
CAGR 2026-203610.5%
Volume 2026660 tonnes
Volume 20361,791 tonnes
Average price 2026USD 366,700 per tonne
Report priceStarts from USD 1,999
PublishedNovember 2026

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Chiplet Underfills market size and forecast, 2026-2036

Exhibit 1The global chiplet underfills market is forecast to grow from USD 242 mn in 2026 to USD 657 mn by 2036, more than doublingGlobal market value in USD: 2025 base year, 2026 estimate and forecast to 2036. CAGR 2026 to 2036: 10.5%
Chiplet Underfills market value, 2025 to 2036Market value by year. 2025: USD 220 mn; 2026: USD 242 mn; 2027: USD 267 mn; 2028: USD 295 mn; 2029: USD 327 mn; 2030: USD 361 mn; 2031: USD 399 mn; 2032: USD 441 mn; 2033: USD 487 mn; 2034: USD 538 mn; 2035: USD 594 mn; 2036: USD 657 mn. Compound annual growth rate 2026 to 2036: 10.5%.2025242 mn2026399 mn2031657 mn203610.5% CAGR

Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.

YearMarket value
2026USD 242 mn
2027USD 267 mn
2028USD 295 mn
2029USD 327 mn
2030USD 361 mn
2031USD 399 mn
2032USD 441 mn
2033USD 487 mn
2034USD 538 mn
2035USD 594 mn
2036USD 657 mn

Chiplet Underfills market segmentation

By type

Exhibit 2Capillary underfill is the largest segment by type, with 62.0% of 2026 revenueEstimated share of 2026 global revenue, by type
Chiplet Underfills market share by type, 2026Share of 2026 revenue by type. Capillary underfill: 62.0%; Molded underfill: 22.0%; Non-conductive paste and film: 16.0%.Capillary underfill62.0%Molded underfill22.0%Non-conductive paste and film16.0%

Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.

SegmentShare 2026Share 2036Value 2026CAGR 2026-36
Capillary underfill62.0%56.6%USD 150 mn9.5%
Molded underfill22.0%25.2%USD 53 mn12.0%
Non-conductive paste and film16.0%18.3%USD 39 mn12.0%

By end use

Exhibit 3High-performance computing and AI adds the most revenue by end use, growing from USD 87 mn in 2026 to USD 317 mn by 2036Estimated revenue in USD by end use, 2026 and 2036 forecast
Chiplet Underfills market by end use, 2026 and 2036Revenue by end use in 2026 and 2036. High-performance computing and AI: USD 87 mn in 2026, USD 317 mn in 2036, change +264%; Smartphones and consumer devices: USD 82 mn in 2026, USD 167 mn in 2036, change +103%; Automotive: USD 44 mn in 2026, USD 111 mn in 2036, change +155%; Other: USD 29 mn in 2026, USD 62 mn in 2036, change +112%.20262036 forecastChangeHigh-performance computing and AI+264%87 mn317 mnSmartphones and consumer devices+103%82 mn167 mnAutomotive+155%44 mn111 mnOther+112%29 mn62 mn

Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.

SegmentShare 2026Share 2036Value 2026CAGR 2026-36
High-performance computing and AI36.0%48.3%USD 87 mn13.8%
Smartphones and consumer devices34.0%25.4%USD 82 mn7.3%
Automotive18.0%16.9%USD 44 mn9.8%
Other12.0%9.4%USD 29 mn7.8%

By filler

SegmentShare 2026Share 2036Value 2026CAGR 2026-36
Silica-filled epoxy62.0%58.0%USD 150 mn9.8%
Thermally conductive (alumina, boron nitride)24.0%28.0%USD 58 mn12.2%
Low-stress and unfilled14.0%14.0%USD 34 mn10.5%

By package type

SegmentShare 2026Share 2036Value 2026CAGR 2026-36
2.5D interposer34.0%36.0%USD 82 mn11.1%
3D stacked14.0%22.0%USD 34 mn15.6%
Fan-out20.0%20.0%USD 48 mn10.5%
Flip-chip BGA32.0%22.0%USD 77 mn6.4%

By cure method

SegmentShare 2026Share 2036Value 2026CAGR 2026-36
Thermal cure66.0%58.0%USD 160 mn9.1%
Snap-cure24.0%28.0%USD 58 mn12.2%
UV-assisted10.0%14.0%USD 24 mn14.3%

Top 25 countries for chiplet underfills by revenue

Countries are ranked by revenue earned from sales in the country, not by where the product is made. The ten largest hold 99.0% of 2026 revenue and the 25 countries below together hold 99.7%.

Exhibit 4Taiwan is the largest country market at USD 63 mn in 2026, and the three largest countries hold 60.0% of global revenueEstimated 2026 revenue in USD and share of the global market, ten largest countries
Chiplet Underfills market, ten largest countries in 2026Ten largest countries by 2026 revenue. Taiwan: USD 63 mn, 26.0%; China: USD 48 mn, 20.0%; South Korea: USD 34 mn, 14.0%; United States: USD 29 mn, 12.0%; Japan: USD 22 mn, 9.0%; Malaysia: USD 15 mn, 6.0%; Singapore: USD 12 mn, 5.0%; Philippines: USD 8.5 mn, 3.5%; Vietnam: USD 4.8 mn, 2.0%; Germany: USD 3.6 mn, 1.5%.Taiwan63 mn 26.0%China48 mn 20.0%South Korea34 mn 14.0%United States29 mn 12.0%Japan22 mn 9.0%Malaysia15 mn 6.0%Singapore12 mn 5.0%Philippines8.5 mn 3.5%Vietnam4.8 mn 2.0%Germany3.6 mn 1.5%

Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.

#CountryValue 2026Share 2026Value 2036CAGR 2026-36
1TaiwanUSD 63 mn26.0%USD 177 mn10.9%
2ChinaUSD 48 mn20.0%USD 143 mn11.4%
3South KoreaUSD 34 mn14.0%USD 87 mn9.8%
4United StatesUSD 29 mn12.0%USD 81 mn10.9%
5JapanUSD 22 mn9.0%USD 47 mn7.9%
6MalaysiaUSD 15 mn6.0%USD 41 mn10.9%
7SingaporeUSD 12 mn5.0%USD 31 mn9.8%
8PhilippinesUSD 8.5 mn3.5%USD 20 mn8.8%
9VietnamUSD 4.8 mn2.0%USD 16 mn13.0%
10GermanyUSD 3.6 mn1.5%USD 7.9 mn8.1%
11IrelandUSD 0.38 mn0.2%USD 0.99 mn10.0%
12IsraelUSD 0.30 mn0.1%USD 0.78 mn10.0%
13ThailandUSD 0.23 mn0.1%USD 0.76 mn12.5%
14IndiaUSD 0.18 mn0.07%USD 0.58 mn12.4%
15NetherlandsUSD 0.14 mn0.06%USD 0.37 mn10.1%
16FranceUSD 0.11 mn0.05%USD 0.29 mn10.0%
17HungaryUSD 87 thousand0.04%USD 0.22 mn9.9%
18Czech RepublicUSD 68 thousand0.03%USD 0.17 mn9.7%
19CanadaUSD 53 thousand0.02%USD 0.14 mn10.0%
20AustriaUSD 41 thousand0.02%USD 0.11 mn9.8%
21MexicoUSD 31 thousand0.01%USD 85 thousand10.5%
22ItalyUSD 24 thousand0.01%USD 66 thousand10.5%
23SpainUSD 19 thousand0.008%USD 53 thousand10.5%
24PolandUSD 15 thousand0.006%USD 39 thousand10.5%
25IndonesiaUSD 12 thousand0.005%USD 33 thousand10.5%
Rest of worldUSD 0.72 mn0.3%USD 2.5 mn13.4%
Exhibit 5Taiwan and China account for 50% of the USD 415 mn the market is forecast to add by 2036Forecast revenue added between 2026 and 2036 by country, in USD
Chiplet Underfills market, where the growth to 2036 comes fromRevenue added between 2026 and 2036. Market value 2026: USD 242 mn. Taiwan: +USD 114 mn; China: +USD 94 mn; South Korea: +USD 53 mn; United States: +USD 52 mn; Malaysia: +USD 26 mn; 20 other countries: +USD 74 mn; Rest of world: +USD 1.8 mn. Market value 2036: USD 657 mn.Market value 2026242 mnTaiwan+114 mnChina+94 mnSouth Korea+53 mnUnited States+52 mnMalaysia+26 mn20 other countries+74 mnRest of world+1.8 mnMarket value 2036657 mn

Source: Compare Market Research analysis.
© 2026 Compare Market Research. All rights reserved.

Competitive landscape

Group 1: Global leaders

  • Henkel
  • Namics
  • Resonac
  • Sumitomo Bakelite
  • Nagase ChemteX
  • Dow
  • LORD

Group 2: Regional and specialist players

  • Shin-Etsu Chemical
  • Panasonic Industry
  • Zymet
  • Master Bond
  • DELO
  • Kyocera Chemical
  • ThreeBond

Group 3: Emerging and niche players

  • Epoxy Technology
  • Darbond Technology
  • Panacol

Research methodology

Every figure on this page comes from the research framework that we apply to all of the markets we cover. The 2025 base for the chiplet underfills market is built from the volume sold and the price that buyers pay, and is cross-checked against the size of the wider industry the market belongs to. Where a market can be sized in more than one way, the routes are compared before a figure is set.

The forecast runs year by year from the 2025 base to 2036. Growth in each year reflects demand from the industries that buy the product, adoption of new technology, pricing, regulation and replacement cycles. Volume and price are modelled together, so revenue in each year equals volume multiplied by average price. The 2026 to 2036 compound annual growth rate of 10.5% is calculated from the resulting values.

The market is divided by type, by end use, by filler, by package type, by cure method. The 25 largest countries are ranked by revenue earned from sales to buyers in each country, not by where the product is made. Segment values and country values add up to the market total in every year, and every report is checked for consistency before it is published.

Companies are placed in three groups: global leaders, regional and specialist players, and emerging and niche players. The groups describe how companies compete in the market. They are not a ranking and they are not market shares.

Our analysts also carry out primary research. Customized reports add interviews with key opinion leaders, such as senior executives, technical specialists and buyers, to test the assumptions behind the numbers for the question being asked.

Read the full research methodology

Frequently asked questions

How big is the chiplet underfills market?

The global chiplet underfills market is estimated at USD 220 mn in 2025 and USD 242 mn in 2026.

How fast will the chiplet underfills market grow?

It is forecast to reach USD 657 mn by 2036, a compound annual growth rate of 10.5% from 2026, an increase of USD 415 mn.

Which country is the largest market for chiplet underfills?

Taiwan is the largest market by revenue at USD 63 mn in 2026, 26.0% of the global total. The three largest countries together hold 60.0%.

Which country is growing fastest?

Among the ten largest markets, Vietnam is growing fastest at 13.0% a year from 2026 to 2036.

Which chiplet underfills segment is largest?

In the by type split, Capillary underfill is the largest segment with 62.0% of 2026 revenue.

Who are the leading chiplet underfills companies?

Global leaders include Henkel, Namics, Resonac, Sumitomo Bakelite.

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